International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
InPerson| Event Type | Conference |
| Submission Deadline | 2/19/2024 |
| Start Date | 9/27/2024 |
| End Date | 9/28/2024 |
| City and Country | San Jose, United States of America |
| Website | https://event.asme.org/InterPACK |
| Organized by | ASME |
InterPACK is the premier international conference for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and heterogeneous integration. |
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