International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
InPersonEvent Type | Conference |
Submission Deadline | 2/19/2024 |
Start Date | 9/27/2024 |
End Date | 9/28/2024 |
City and Country | San Jose, United States of America |
Website | https://event.asme.org/InterPACK |
Organized by | ASME |
InterPACK is the premier international conference for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and heterogeneous integration. |
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